Chemical vapor deposition wafer carrier with thermal cover



FIG. 1 is a perspective view of a first embodiment of a chemical vapordeposition wafer carrier with thermal cover showing our new design.

FIG. 2 is a top plan view of the chemical vapor deposition wafer carrierwith thermal cover of FIG. 1.

FIG. 3 is a right side view of the chemical vapor deposition wafercarrier with thermal cover of FIG. 1, with the left side view, frontview, and rear view being identical.

FIG. 4 is a bottom plan view of the chemical vapor deposition wafercarrier with thermal cover of FIG. 1.

FIG. 5 is a perspective view of a second embodiment of a chemical vapordeposition wafer carrier with thermal cover, showing our new design,which differs from the first embodiment shown in FIGS. 1-4 in that itincludes staples extending through the thickness of the chemical vapordeposition wafer carrier with thermal cover.

FIG. 6 is an exploded view of the chemical vapor deposition wafercarrier with thermal cover of FIG. 5.

FIG. 7 is a perspective view of a third embodiment of a chemical vapordeposition wafer carrier with thermal cover, which differs from thefirst embodiment shown in FIGS. 1-4 in that it does not include staplesor apertures for staples in the radially outer portion of the chemicalvapor deposition wafer carrier with thermal cover; and,

FIG. 8 is a bottom perspective view of the chemical vapor depositionwafer carrier with thermal cover of FIG. 7.

In each of the figures, portions or features shown in broken lines formno part of the claimed design.

CLAIM The ornamental design for a chemical vapor deposition wafercarrier with thermal cover, as shown and described.